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By Deborah D. L. Chung

Fabrics are the basis of expertise. As such, so much universities supply engineering undergraduates with the elemental suggestions of fabrics technological know-how, together with crystal constructions, imperfections, part diagrams, fabrics processing, and fabrics homes. Few, notwithstanding, provide the sensible, applications-oriented heritage that their scholars have to achieve industry.

Applied fabrics technology: purposes of Engineering fabrics in Structural, Electronics, Thermal, and different Industries fills that hole. From a cross-disciplinary point of view that displays either the multifunctionality of many fabrics and the vast scope commercial wishes, the writer examines the sensible functions of steel, ceramic, polymer, cement, carbon, and composite fabrics throughout a wide diversity of industries. the themes addressed contain digital packaging, clever fabrics, thermal administration, nondestructive evaluate, and fabrics improvement. The textual content is apparent, coherent, and instructional fashionable, contains a number of updated references, and gives heritage fabric in a chain of appendices.

Unique in its breadth of assurance of either fabrics and their functions, utilized fabrics technological know-how is either scientifically wealthy and technologically proper. in the event you paintings or educate those who aspire to paintings in an engineering skill, you can find no textual content or reference that higher prepares its readers for real-world purposes of engineering fabrics.

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Additional info for Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries

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Thus, oxidation-resistant fillers are essential. Silver and gold are oxidation resistant, but copper is not. Due to the high cost of silver and gold, the coating of copper, nickel, or other lowercost metal fillers by gold or silver is common for improving oxidation resistance. 43,44 A z-axis anisotropic electrical conductor film is electrically conducting in the direction perpendicular to the film, but is insulating in all other directions. This film is technologically valuable for use as an interconnection material in electronic packaging, as it electrically connects the electrical contact pads touching one side of the film with the corresponding contact pads touching the direct opposite side of the film.

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The choice of a metal in a thick-film paste depends on the need for withstanding air oxidation in the heating encountered in subsequent processing, which can be the firing of the green thickfilm together with the green ceramic substrate (a process known as cofiring). It is during cofiring that bonding and sintering take place. Copper is an excellent conductor, but it oxidizes readily when heated in air. The choice of metal also depends on the temperature encountered in subsequent processing. Refractory metals, such as tungsten and molybdenum, are suitable for interconnections heated to high temperatures (> 1000°C), for example during Al2O3 substrate processing.

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